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Keywords: Solder
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Journal Articles
Journal of Manufacturing Technology Management (2005) 16 (3): 343–359.
Published: 01 April 2005
... There is no study dedicated to the investigation of the second‐side thermal‐profile variance with and without the presence of primary‐side components. The study suggests that a variant oven‐setting strategy for the second‐side reflow process is important to ensure reflow‐soldering quality. A typical reflow oven...
