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Gate-all-around (GAA) nanosheet field-effect transistors (NSFETs) are a potential replacement for the state-of-the-art fin field-effect transistor (FinFET) devices at advanced technology nodes. In this paper, the impact of process-induced variability such as gate work function variation (WFV) on NSFETs using three-dimensional technology computer-aided design numerical device simulation is studied. The WFVs of NSFETs and nanowire field-effect transistors (NWFETs) using multiple stack channels are also analyzed. The fluctuations in the threshold voltage (σVTH) and on current (σIon) of NSFETs are mainly affected by the WFV of the metal gate. It is observed that single and three-stacked NSFETs show superior immunity to WFV compared with NWFETs. Furthermore, a layout-based NSFET inverter design using the design technology co-optimization technique is followed, and the advantages of stacked NSFETs in terms of delay, power dissipation and switching energy are also reported.

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