The strengths of mechanical-connected and adhesive-bonded joining systems are combined to develop an improved connection system for advanced composite materials. The principle of resistance enhancement is based on the insertion of small diameter pins through an adhesive joint. The pins act as local reinforcement in the most highly stressed regions of the joint, enabling an adhesive joint to carry an increased load prior to failure. In a series of single-lap shear experiments using glass fibre reinforced polymer samples, adhesive-only and pinned-only specimens failed in the joint region. In contrast, many of the pinned/bonded specimens failed away from the joint at a significantly higher load. Insight was gained regarding the influence of the pin material, diameter, number and configuration on the resulting performance. The results demonstrated the potential of pinned/bonded systems as a new method for connecting composite materials. However, further work is necessary to confirm the sensitivity of the results to changes in parameters such as the fibre architecture, adherend geometry, adhesive interface and joint configuration.
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January 2004
Research Article|
January 01 2004
Mechanical/bonded joints for advanced composite structures Available to Purchase
J. M. Lees;
J. M. Lees
Lecturer in Structural Engineering
University of Cambridge, Department of Engineering
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G. Makarov
G. Makarov
Research Fellow
School of Engineering Sciences, Ship Science, The University of Southampton
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Publisher: Emerald Publishing
Received:
June 04 2003
Accepted:
September 26 2003
Online ISSN: 1751-7702
Print ISSN: 0965-0911
© 2004 Thomas Telford Ltd
2004
Proceedings of the Institution of Civil Engineers - Structures and Buildings (2004) 157 (1): 91–97.
Article history
Received:
June 04 2003
Accepted:
September 26 2003
Citation
Lees JM, Makarov G (2004), "Mechanical/bonded joints for advanced composite structures". Proceedings of the Institution of Civil Engineers - Structures and Buildings, Vol. 157 No. 1 pp. 91–97, doi: https://doi.org/10.1680/stbu.2004.157.1.91
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