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Keywords: intermetallic compound
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Journal Articles
Shutong Wang, MSc, Ruijue Lv, MSc, Jinhu Li, MSc, Zhe Li, PhD, Yue Zhang, PhD, Sicheng Wang, MSc, Yuxin Luo, MSc, Junjie Chen, MSc, Zhenwei Yu, PhD, Xiaolin Wang, PhD
Journal:
Surface Innovations
Surface Innovations (2025) 13 (3): 187–198.
Published: 30 January 2025
... conductivity, and ductility. However, the wetting behavior between indium and nickel or its alloys, commonly used as bonding layers, is often suboptimal in soldering applications. This study investigates the high-temperature wetting behavior and intermetallic compound (IMC) growth between indium and NiCu alloy...
Includes: Supplementary data
