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Substrate materials that can be sintered at temperatures lower than 1000°C have been prepared and studied. The main compositions were achieved by adding low softening point glasses to cordierite. A 96‐97% relative density can be obtained for cordierite to which 50‐60 wt% borosilicate glass is added. The dielectric constants are approximately 5.5‐6.5, and the loss tangents are below 2% at 1 MHz. Lamination of five layers of the aforementioned material tape‐cast into green tapes (40 mm × 40 mm) can be sintered into a single substrate (34 mm × 34 mm). In addition, the compatibility between the substrate material and the inner electrode and buried resistor material has also been studied.

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