Skip to Main Content
Article navigation

Soldering techniques for surface mount technology are still in their early stages. Therefore, a survey is given of the main soldering methods which are currently used in research and production as well as those which are expected to come into use, such as wave soldering, infra‐red soldering, vapour phase soldering and laser soldering. These techniques are influenced by both the component and board design. Even in soldering surface mount components, a number of rules must be observed in order to produce a good solder joint.

This content is only available via PDF.
You do not currently have access to this content.
Don't already have an account? Register

Purchased this content as a guest? Enter your email address to restore access.

Please enter valid email address.
Email address must be 94 characters or fewer.
Pay-Per-View Access
$41.00
Rental

or Create an Account

Close Modal
Close Modal