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Volume 6, Issue 3
1 March 1989
This article was originally published in
Hybrid Circuits
Hybrid Circuits Cover Image for Volume 6, Issue 3
Review Article| March 01 1989

Characterisation of Die Attach Adhesives

M. Remškar;
M. Remškar
Iskra Kibernetika, Kranj, Yugoslavia
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D. Ročak
D. Ročak
Iskra Kibernetika, Kranj, Yugoslavia Institut Jožef Stefan, Ljubljana, Yugoslavia
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 2977-7062
Print ISSN: 0265-3028
© MCB UP Limited
1989
Hybrid Circuits (1989) 6 (3): 14–17.
https://doi.org/10.1108/eb044383

Several commercially available epoxy and polyimide adhesives were tested. The properties essential for the use of adhesives in microelectronics are stated and their compliance with the requirements of standard MIL‐A‐87‐172 was evaluated.

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© MCB UP Limited
1989
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