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Volume 7, Issue 3
1 March 1990
This article was originally published in
Hybrid Circuits
Hybrid Circuits Cover Image for Volume 7, Issue 3
Review Article| March 01 1990

Packaging Options for High Lead Count ASIC Devices Available to Purchase

S.T. Riches
S.T. Riches
The Welding Institute, Abington, Cambridge, England
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 2977-7062
Print ISSN: 0265-3028
© MCB UP Limited
1990
Hybrid Circuits (1990) 7 (3): 14–21.
https://doi.org/10.1108/eb044421

Selection of the correct interconnection technique for high lead count integrated circuits is dependent on technical and economic factors, in particular in small batch production of application specific devices (ASICs). This paper reviews some of the interconnection options and describes work where some advances in high density interconnection have been made.

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© MCB UP Limited
1990
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