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Keywords: AIP
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2023) 40 (2): 104–108.
Published: 30 September 2022
...Gang Wang; Chenhui Xia; Bo Wang; Xinran Zhao; Yang Li; Ning Yang Purpose A W-band antennas-in-packages (AIP) module with a hybrid stacked glass-compound wafer level fan-out process was presented. Heterogeneous radio frequency (RF) chips were integrated into one single module with a microscale fan...
