...Yow-Ching Liaw; Shou-Yen Chao; Jung-Hua Chou Purpose The purpose of this paper is to determine the key process factors which affect the adhesion strength of encapsulation molding compounds (EMCs) to leadframes to obtain reliable components without any need to pretreat the leadframe surface...

...A.J. Curley; K.J. Williams; T. Le; H. Patel This paper describes failure load analysis to predict the number of fatigue cycles required to cause adhesion failure at the thick film conductor and alumina substrate interface in ball grid array packages (BGAs). This enables prediction of the number...

.... The applied frits have improved the adhesion and superconductor properties at the same time due to a superconductor bridge formation between the grains. Both YBCO and BSCCO systems have been analyzed. The results are promising. Fabrication of standard YBa₂Cu₃O₇ (123) inks...

...J. Falk The influence of process heat, with regard to wire‐ and substrate‐materials, on the adhesion of wire‐bonds was investigated. Temperature increases up to 200°C were measured on the interface between surface and wire. This temperature is the basis for demonstrating the important influence...