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Keywords: Au stud bump
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Journal Articles
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times
Available to PurchaseXiangou Zhang, Yuexing Wang, Xiangyu Sun, Zejia Deng, Yingdong Pu, Ping Zhang, Zhiyong Huang, Quanfeng Zhou
Journal:
Microelectronics International
Microelectronics International (2024) 41 (2): 82–88.
Published: 17 April 2023
...Xiangou Zhang; Yuexing Wang; Xiangyu Sun; Zejia Deng; Yingdong Pu; Ping Zhang; Zhiyong Huang; Quanfeng Zhou Purpose Au stud bump bonding technology is an effective means to realize heterogeneous integration of commercial chips in the 2.5D electronic packaging. The purpose of this paper is to study...
