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1-4 of 4
Keywords: Ball grid array
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Journal Articles
The cyclic fatigue behaviour of ball grid arrays
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3): 43–45.
Published: 01 December 1999
...A.J. Curley; K.J. Williams; T. Le; H. Patel This paper describes failure load analysis to predict the number of fatigue cycles required to cause adhesion failure at the thick film conductor and alumina substrate interface in ball grid array packages (BGAs). This enables prediction of the number...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Intertronics Ball grid array Unique BGA reballing solution from Intertronics Keywords Intertronics, Ball grid array SolderQuik™ BGA from Intertronics, is a unique solution to low to medium volume reballing of ball grid array components...
Journal Articles
Fatigue Properties of BGA Solder Joints: A Comparison of Thermal and Power Cycle Tests
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (1997) 14 (3): 21–30.
Published: 01 December 1997
..., crack initiation and growth in ball solder joints were studied by metallographic analysis. The practical measurements serve as analytical input to compare thermal and power cycle tests and they are a necessary step to perform a lifetime prediction. © MCB UP Limited 1997 Ball grid array...
Journal Articles
Are BGAs a Concern in SMT? A User’s Point of View
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (1996) 13 (1): 22–25.
Published: 01 April 1996
.... Ball grid array Components Surface mount Technology Microelectronics During 1994, Bull has carried out industrial assembly of ball grid arrays (BGAs) on electronic boards devoted to UNIX servers. The first BGA used was a 256 I/O ceramic one (CBGA) housing the 601 or 604 Power PC. BGA use...
