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Keywords: Bending test
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Journal Articles
Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2024) 41 (3): 172–178.
Published: 15 April 2024
... of several simplifying assumptions. This study introduces and validates simplified assumptions for modeling a four-point bend test on a PCB/wafer-level chip scale packaging assembly. Design/methodology/approach In this study, simplifying assumptions were used. These involved substituting dynamic imposed...
