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Keywords: Bump voids
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Journal Articles
Journal:
Microelectronics International
Microelectronics International 1–8.
Published: 14 November 2025
... and PI thicknesses on void formation are clarified. Optimal combinations of these factors are identified, which can effectively reduce the occurrence of voids in bumps. Originality/value This research systematically investigates the complex interactions of multiple factors on bump voiding using DOE...
