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Keywords: Ceramic package
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2015) 32 (3): 143–148.
Published: 03 August 2015
...Dr Agata Skwarek; Marcin Myśliwiec; Ryszard Kisiel; Marek Guziewicz Purpose – The purpose of this paper is to deal with material and technological aspects of SiC diodes assembly in ceramic packages. The usefulness of combinations of different materials and assembly techniques for the creation...
