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Keywords: Chip on board (COB)
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2020) 37 (3): 117–124.
Published: 03 February 2020
... packaging Advanced packaging Chip on board (COB) Solder joints are used as electrical, thermal interconnections and mechanical supports for microelectronic devices, regarding as the weakest link in their reliability (Clech et al., 2019 ; Lu et al., 2018). Recently, considering...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2016) 33 (1): 1–8.
Published: 04 January 2016
.... Andrzej Kos can be contacted at: kos@agh.edu.pl © Emerald Group Publishing Limited 2016 Microelectronics packaging Advanced packaging Chip on board (COB) Ceramics Blind people Thermal screen Blind people can receive information in different ways (Vidal-Verdú and Hafez, 2007). One...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2015) 32 (1): 8–17.
Published: 05 January 2015
... increases. Jae B. Kwak can be contacted at: jae.kwak@samsung.com © Emerald Group Publishing Limited 2015 Micro-electro-mechanical systems (MEMS) Microelectronics packaging Advanced packaging Chip on board (COB) There have been major researches dealing with thermo-hygro...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (2013) 30 (1): 3–9.
Published: 18 January 2013
... to the low thermal conductivity of ceramic materials. For example, the conductivity of LTCC (alumina+glass) is less than 5 W/mK. © Emerald Group Publishing Limited 2013 Thermal conductivity Thermal resistance Ceramics Low temperature co‐fired ceramic (LTCC) Chip on board (COB) Junction...
