...Michael Scheffler; Gerhard Tröster; Joaquin Lopez Contreras; Jürgen Hartung; Michel Menard Passive components integrated into a high‐density substrate can be a tolerable way to overcome the size and manufacturing limits of SMD passives mounted on to the system board. Still, this technology...

... and the basic rules for practical application are summarised. After manufacturing the assembled PCBs all the resistors were electrically tested before thermal cycling. All components exhibited an electrical resistance, which was within the tolerance of the used resistor (1,000Ω ± 5 percent). © MCB UP...

...John Wall; Nihal Sinnadurai This paper identifies component industry trends, examines the traditional methods of achieving “space quality”, addresses how the space industry can adapt to this changing scenario, looks at the options for space standardisation/qualification, challenges some established...

...V. Kripesh; S.K. Bhatnagar; H. Osterwinter; W. Gust A laser ablation technique has been used to fabricate conductor patterns on a 96%alumina substrate to evolve passive fine‐line components and structures. This paper reports the method of fabricating better fine‐line passive components for hybrid...

...X. Saint‐Martin; Y. Stricot; M. Auray; C. Floury BGAs are a new type of surface mountable component. Successful industrial implementation of BGA assembly on electronic boards needs specific studies, evaluations and qualification. The methodology used in Bull is presented,along with an analysis...