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Keywords: Contamination solution
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Journal Articles
Tin contamination in PQFN package and its effects on wire bondability
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2013) 30 (3): 176–186.
Published: 26 July 2013
... solution accordingly for the issue. Han‐min Zhang can be contacted at: afzong@163.com © Emerald Group Publishing Limited 2013 Tin contamination PQFN package Wire bondability Bond integrity Contamination solution Contamination Wires In the semiconductor industry, wire bonding...
