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Keywords: Copper pillar bump
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2021) 38 (4): 172–181.
Published: 23 September 2021
...Mohammad Hafifi Hafiz Ishak; Mohd Sharizal Abdul Aziz; Farzad Ismail; M.Z. Abdullah Purpose The purpose of this paper is to present the experimental and simulation studies on the influence of copper pillar bump structure on flip chip packaging during reflow soldering. Design/methodology...
