... © MCB UP Limited 2002 --> Datacon Datacon phases out collaboration with Kulicke & Soffa Keyword: Datacon Datacon Technology AG, will in future be working completely independently in the US and Asia. The Austrian company is responding to the increasing demand...

... © MCB UP Limited 2001 --> Datacon Datacon's 4-million-euro investment: new building ready after just 10 months Keyword Datacon With the official opening on 18 May 2001, Datacon Semiconductor Equipment GmbH, based in Radfeld, Austria, successfully completed its...

... © MCB UP Limited 2001 --> Datacon Datacon Semiconductor Equipment GmbH appoints new head of product management Keyword: Datacon Engineer Harald Körber (Dipl. Ing.) was appointed Head of Product Management at Datacon Semiconductor Equipment GmbH in Radfeld, Austria...

... © MCB UP Limited 2001 --> Datacon Multimillion-euro orders from Asia and the USA lead to massive sales surge at Datacon Keyword: Datacon Datacon Semiconductor Equipment GmbH has landed the biggest individual order in the company's history: one of the world's...

... © MCB UP Limited 2000 --> Datacon Growth Datacon continues to grow – preparations begin for second expansion within two years Keywords Datacon, Growth Datacon, a leading European die bond manufacturer, is set to expand again,just 12 months after the completion...

... © MCB UP Limited 2000 --> Kulicke & Soffa DATACON Keywords Kulicke & Soffa, DATACON As a further step on the road to "total packaging solutions", Kulicke &Soffa Industries, and DATACON Semiconductor Equipment GmbH, recently opened a joint technology center...

... the shadow mask is at its maximum. As soon as the test piece surface moves out of focus, the intensity of the signal received by the detector is reduced. For further information contact Monika Walcher, Datacon Semiconductor Equipment GmbH, InnStr. 16, A-6240 Radfeld, Austria. Tel: +43-5337-600-104; Fax...

... © MCB UP Limited 2000 --> Datacon Inspection Total solutions for the back end from datacon Keywords: Datacon, Inspection The new 3D inspection system 8000 enables the analysis of three-dimensional image data for bump, wire, wafer and post-bonding inspections...