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Journal Articles
Journal Articles
Microelectronics International (2013) 30 (3): 125–133.
Published: 26 July 2013
...Dominik Jurków Purpose The paper aims to present numerical modeling and technology of a very first three axial low temperature cofired ceramics (LTCC) accelerometer. Design/methodology/approach Low temperature cofired ceramics technology was applied in the fabrication process of the novel...
Journal Articles
Microelectronics International (2007) 24 (2): 46–52.
Published: 24 April 2007
...Radhalakshmi Ramakrishnan; Maqsood A. Chaudhry Purpose This paper aims to present a design of a single power supply, low voltage (1.2) high performance operational amplifier using 0.13 μm technology whose characteristics are superior compared to the other designs available...
Journal Articles
Microelectronics International (2006) 23 (3): 49–54.
Published: 01 September 2006
... PLLs derived from the two architectures can be estimated, are analysed and their future behaviours as a function of technology are predicted. Design/methodology/approach Analogue models were developed and Mentor Graphics VHDL‐AMS mixed‐signal simulations were performed on the two PLL architectures...
Journal Articles
Microelectronics International (2006) 23 (3): 3–8.
Published: 01 September 2006
...Y.H. Chan; C.C. Lim; K.T. Lau; S.H. Foo Purpose To show new design methodology of low power circuit design (Low Power Critical Voltage Transition Logic – LPCVTL) over the conventional CVTL methodology. The comparison is in terms of speed, area and power consumption. Design/methodology/approach...
Journal Articles
Microelectronics International (2005) 22 (3): 34–38.
Published: 01 December 2005
...Radhalakshmi Ramakrishnan; Maqsood A. Chaudhry Purpose In this paper, we study the effect on the performance of a single supply low voltage operational amplifier due to such a mismatch. Design/methodology/approach We start with a given set of specifications and design a MOSFET based...
Journal Articles
Microelectronics International (2005) 22 (3)
Published: 01 December 2005
... Design Automation Conference Professional Development Fund to award more than $165,000 Keywords: Automation, Design, Financing The Design Automation Conference (DAC), the electronic design automation(EDA) industry's premier event, together with several sponsoring societies...
Journal Articles
Journal Articles
Journal Articles
Microelectronics International (2003) 20 (1)
Published: 01 April 2003
...Bob Willis © MCB UP Limited 2003 --> Electronics Design Manufacturing Six Sigma for Electronics Design and Manufacturing Sammy G. ShinaMcGraw-Hill, Professional Engineering Series363 pp., 11 chapters illustrated with tables and diagrams Keywords: Electronics...
Journal Articles
Microelectronics International (2000) 17 (2)
Published: 01 August 2000
... © MCB UP Limited 2000 --> Philips Semiconductors Design Keywords Philips Semiconductors, Design Philips Semiconductors leverages VLSI Velocity RSP to deliver a hardware/software co-design environment for its Nexperia Silicon System Platforms: By providing its...
Journal Articles
Microelectronics International (2000) 17 (2)
Published: 01 August 2000
... "In future, IP will become the essential condition for doing global business',' said Theo Claasen, chief technology officer, Philips Semiconductors."OEMs will no longer choose their silicon suppliers purely on the grounds of semiconductor process technologies, design flows and manufacturing...
Journal Articles
Microelectronics International (1999) 16 (3)
Published: 01 December 1999
... library of standard cells, together with EDA design kits for popular tools. As part of the 0.25 micron offering, the IC service also provides back-end place-and-route layout service using the most advanced layout tools. Its current MPW portfolio provides a range of other technologies, including...
Journal Articles
Microelectronics International (1998) 15 (1): 35–38.
Published: 01 April 1998
... and flip‐chip technologies on product development and manufacturing processes is addressed. Simulation tools can shorten considerably the design cycle. The simulation (electrical and/or thermo‐mechanical) can reveal design errors and find out maximum stress concentrations in the mechanical structure...
Journal Articles
Microelectronics International (1996) 13 (1): 49–51.
Published: 01 April 1996
...M.J. Stoklosa The Intelligent MCM Analyser (IMCMA) is a software tool which allows the designer to concurrently assess the reliability of an MCM design based on operational parameters. Traditionally, this type of assessment takes days to accomplish and is performed after the design phase...

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