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Journal Articles
Microelectronics International (2019) 36 (3): 109–113.
Published: 18 June 2019
... as the gate dielectric, the optimization processes of dry etching in plasma environment by Taguchi method were realized. In the next step, three methods of AlN etching were selected and used to MISFET device fabrication. Atomic force microscopy and scanning electron microscopy allowed to surfacing...

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