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Keywords: Electrical simulation
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Journal Articles
The advanced leadless leadframe package and its characteristics
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2023) 40 (2): 159–165.
Published: 16 February 2023
... existing leadframe package was developed and studied if it overcome the limitations of leadframe and laminate products. Asymmetric land layout was designed and special features to keep electrical interference was applied to prove design flexibility. The thermal and electrical simulation has been executed...
