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Keywords: Encapsulation molding compound
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Journal Articles
Process factors affecting adhesion of encapsulation molding compounds
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Journal:
Microelectronics International
Microelectronics International (2018) 35 (2): 97–103.
Published: 03 April 2018
...Yow-Ching Liaw; Shou-Yen Chao; Jung-Hua Chou Purpose The purpose of this paper is to determine the key process factors which affect the adhesion strength of encapsulation molding compounds (EMCs) to leadframes to obtain reliable components without any need to pretreat the leadframe surface...
