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Keywords: FEM
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Journal Articles
Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2024) 41 (3): 172–178.
Published: 15 April 2024
... 25 03 2024 25 03 2024 © Emerald Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only Flip-chip Bending test FEM Reliability Solder bumps The comparisons of the distribution of the principal plastic strain in the solder balls and copper pads...
