... Flip-chip Bending test FEM Reliability Solder bumps Controlling the technology used to develop and produce electronic chips has become a significant political and economic concern. The global crisis resulting from the shortage of electronic chips (2020–2023) has prompted governments to make...

... by JDS/Cronos, and transferred to an alumina substrate by an in‐house developed flip‐chip process. This capacitor is electrostatically actuated. The resulting C‐V response is linear with a slope of 0.05 pF/V for a wide range of actuation voltages. The MEMS device has a capacitance ratio...

... contradictory requirements are difficult to fulfil with conventional SMD technology. Therefore, much attention is paid to packages offering small‐size and high I/O counts as well as excellent electrical properties, such as chip scale packages (CSP) and flip‐chip. CSP offers an IC in a package, which provides...

...Luc Vanwassenhove A straightforward flip‐chip mounting technique is described using gold bumps, a silicon motherboard and non‐conductive adhesives to fabricate electro‐optical modules coupling light from arrays of laser diodes into arrays of fibres. This enables the fabrication of non‐hermetic...