... 25 03 2024 25 03 2024 © Emerald Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only Flip-chip Bending test FEM Reliability Solder bumps The comparisons of the distribution of the principal plastic strain in the solder balls and copper pads...

... by JDS/Cronos, and transferred to an alumina substrate by an in‐house developed flip‐chip process. This capacitor is electrostatically actuated. The resulting C‐V response is linear with a slope of 0.05 pF/V for a wide range of actuation voltages. The MEMS device has a capacitance ratio...

...Luc Vanwassenhove A straightforward flip‐chip mounting technique is described using gold bumps, a silicon motherboard and non‐conductive adhesives to fabricate electro‐optical modules coupling light from arrays of laser diodes into arrays of fibres. This enables the fabrication of non‐hermetic...

... contradictory requirements are difficult to fulfil with conventional SMD technology. Therefore, much attention is paid to packages offering small‐size and high I/O counts as well as excellent electrical properties, such as chip scale packages (CSP) and flip‐chip. CSP offers an IC in a package, which provides...