...Jingxuan Peng; Jingjing Cheng; Lei Wu; Qiong Li Purpose This paper aims to study a high-temperature (up to 200 °C) data acquisition and processing circuit for logging. Design/methodology/approach With the decrease in thermal resistance by system-in package technology and exquisite power...

... to protect PBGA packages from moisture‐induced failures. As part of the study, PBGA packages with and without conformal coatings were subjected to moisture ingress, moisture desorption and unbiased high temperature high humidity tests. The principal failure mechanisms observed were delamination and cracking...

... © MCB UP Limited 2000 --> Semiconductor Equipment corporation Bonding High temperature Keywords Semiconductor Equipment corporation, Bonding, High temperature Semiconductor Equipment Corporation has developed two new work chucks for the device pick-up heads...

... frit of Bi₂O₃/CuO mixture was added to the basic powder. © MCB UP Limited 1998 Adhesion High temperature Superconductors Thick film A lot of efforts have been made since the discovery of high temperature superconductor (HTS) materials to develop HTS thick...

... of construction are recommended. Comparisons are made between package design for high power dissipation and that for high temperature operation. © MCB UP Limited 1996 Reliability Electronics packaging High temperature Microelectronics Traditionally, the maximum allowable operating...