...Jingxuan Peng; Jingjing Cheng; Lei Wu; Qiong Li Purpose This paper aims to study a high-temperature (up to 200 °C) data acquisition and processing circuit for logging. Design/methodology/approach With the decrease in thermal resistance by system-in package technology and exquisite power...

... to protect PBGA packages from moisture‐induced failures. As part of the study, PBGA packages with and without conformal coatings were subjected to moisture ingress, moisture desorption and unbiased high temperature high humidity tests. The principal failure mechanisms observed were delamination and cracking...

... © MCB UP Limited 2000 --> Semiconductor Equipment corporation Bonding High temperature Keywords Semiconductor Equipment corporation, Bonding, High temperature Semiconductor Equipment Corporation has developed two new work chucks for the device pick-up heads...

.... The applied frits have improved the adhesion and superconductor properties at the same time due to a superconductor bridge formation between the grains. Both YBCO and BSCCO systems have been analyzed. The results are promising. Adhesion High temperature Superconductors Thick film © MCB UP...

... of construction are recommended. Comparisons are made between package design for high power dissipation and that for high temperature operation. Above 250°C, it is necessary to use semiconductor materials with larger bandgaps, such as GaAs, and SiC, which, at a given temperature, produce a smaller...