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Keywords: Hybrid
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Journal Articles
Journal Articles
Microelectronics International (2018) 35 (3): 158–163.
Published: 02 July 2018
...Sebastian Löffler; Christopher Mauermann; Angela Rebs; Günter Reppe Purpose The purpose of the paper is to show up the current possibilities by combination of classic thick-film technology with advanced processing. Thick-film hybrid ceramic substrates have been a base for highly reliable devices...

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