...Xuexia Yang; Miao Zhu; Yanxi Sun; Jinbao Lin; Xin Hao; Xuefeng Shu; Gesheng Xiao Purpose The purpose of this study is to investigate the influence of intermetallic compound ( IMC ) layer thickness on the reliability of plastic ball grid array ( PBGA ) lead-free solder joints under thermal cycling...

... and then strongly influence the growth of the intermetallic compounds (IMCs). Thus, it is critical to understand the fundamental aspects of interfacial reaction in micro solder joints. This paper aims to reveal the effect mechanism of reflow temperature and solder size on the interfacial reaction in Cu/Solder/Ni...