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Keywords: Intermetallic compound (IMC)
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Journal Articles
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2025) 42 (2): 18–27.
Published: 13 February 2025
... joints. Design/methodology/approach The interfacial intermetallic compound (IMC) stress gradient was calculated through thermal stress theory, mechanism of voids/cracks initiation was clarified, and prediction of the service life was analyzed with the energy-based model. Findings It is found...
