Keywords: Intermetallic compounds
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

The science-governed interface: a critical review of advanced metallization, intelligent control and characterization strategies for wire bonding technology

Muhammad Nubli Zulkifli
Journal: Microelectronics International
Microelectronics International 1–10.
https://doi.org/10.1108/MI-02-2026-0046
Published: 16 June 2026
... systems: ENEPIG: The Pd Thickness Paradox 25 02 2026 15 04 2026 12 05 2026 © 2026 Emerald Publishing Limited 2026 Emerald Publishing Limited Licensed re-use rights only Wire bonding Metallization Industrial 4.0 Nanoindentation Intermetallic compounds Machine...
View article titled, The science-governed interface: a critical review of advanced metallization, intelligent control and characterization strategies for wire bonding technology
Open the PDF for The science-governed interface: a critical review of advanced metallization, intelligent control and characterization strategies for wire bonding technology in another window
Add to Citation Manager for The science-governed interface: a critical review of advanced metallization, intelligent control and characterization strategies for wire bonding technology
Journal Articles

Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times

Xiangou Zhang, Yuexing Wang, Xiangyu Sun, Zejia Deng, Yingdong Pu, Ping Zhang, Zhiyong Huang, Quanfeng Zhou
Journal: Microelectronics International
Microelectronics International (2024) 41 (2): 82–88.
https://doi.org/10.1108/MI-12-2022-0203
Published: 17 April 2023
.... The investigation shows that the formation of the intermetallic compounds because of the reaction between the Au and Al atoms plays a key role on the bonding strength and fracture behavior variation. Figure 3 The scanning electron microscope images of fracture surface on (a) the big chip and (b) the small chip...
View article titled, Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times
Open the PDF for Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times in another window
Add to Citation Manager for Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times
Journal Articles

Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies

Ye Tian, Heng Fang, Ning Ren, Chao Qiu, Fan Chen, Suresh Sitaraman
Journal: Microelectronics International
Microelectronics International (2020) 37 (3): 117–124.
https://doi.org/10.1108/MI-07-2019-0048
Published: 03 February 2020
...Ye Tian; Heng Fang; Ning Ren; Chao Qiu; Fan Chen; Suresh Sitaraman Purpose This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests...
View article titled, Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies
Open the PDF for Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies in another window
Add to Citation Manager for Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies
This Feature Is Available To Subscribers Only

or Create an Account

Close subscription notice
Close access options