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Keywords: Intermetallic compounds
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Journal Articles
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times
Available to PurchaseXiangou Zhang, Yuexing Wang, Xiangyu Sun, Zejia Deng, Yingdong Pu, Ping Zhang, Zhiyong Huang, Quanfeng Zhou
Journal:
Microelectronics International
Microelectronics International (2024) 41 (2): 82–88.
Published: 17 April 2023
.... The investigation shows that the formation of the intermetallic compounds because of the reaction between the Au and Al atoms plays a key role on the bonding strength and fracture behavior variation. Figure 2 Chip shear test equipment and shear tool Yuexing Wang can be contacted...
Journal Articles
Intermetallics evolution and its reliability effects on micro-joints in flip chip assemblies
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2020) 37 (3): 117–124.
Published: 03 February 2020
...Ye Tian; Heng Fang; Ning Ren; Chao Qiu; Fan Chen; Suresh Sitaraman Purpose This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests...
