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Keywords: Intermetallics
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2002) 19 (2): 38–43.
Published: 01 August 2002
...Tan Chee Wei; Abdul Razak Daud A Cu‐Al bonding system exists when copper wire is bonded onto an aluminum bond pad using thermosonic wire bonding technology. Aged Cu‐Al bonding system was analyzed by measuring the intermetallics layer thickness and its correlation to electrical contact resistance...
Journal Articles
Journal:
Microelectronics International
Microelectronics International (1998) 15 (2): 20–24.
Published: 01 August 1998
...Kari Kulojärvi; Vesa Vuorinen; Jorma Kivilahti The dissolution processes and subsequent intermetallic reactions between high tin solder bump alloys and Cu‐ or Ni‐based UBM‐metallisations were investigated both theoretically and experimentally. The results showed that when the Cu UBM layer is used...
