...Marc van Kleef; Jeroen Bielen; Jan Gülpen; Mike Ramos Purpose In land grid array hybrid or system in package type products passive integration on silicon dies are flip chip mounted on a laminate substrate using Pb‐free solder. To increase the solder bump fatigue life, underfill is applied...

...) technology, to assess the capability of organic based laminate as a high density interconnect. This paper describes the manufacturing experiments performed to produce a laser microvia interconnect solution. The mechanical performance of the interconnect is also presented to confirm its compatibility...