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Keywords: Lift‐off
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Journal Articles
Thermodynamic aspect of the wire‐bonding process
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (1998) 15 (1): 23–31.
Published: 01 April 1998
... bonding and its relation to the materials used will be demonstrated. Adhesion Finite element method Lift‐off Thermodynamics Wire bonding © MCB UP Limited 1998 The temperature signal in Figure 3 is calculated for a 180ms welding process with the assumption that the US power acts...
