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Keywords: Long‐term reliability
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Journal Articles
Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2013) 30 (3): 169–175.
Published: 26 July 2013
...Chong Leong Gan; Francis Classe; Uda Hashim Purpose The purpose of this paper is to provide a systematic method to perform long‐term reliability assessment of gold (Au) and copper (Cu) ball bonds in fineline ball grid array package. Also with the aim to study the apparent activation energies...
