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Keywords: MCCE
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2023) 40 (1): 17–25.
Published: 15 July 2022
... on the surface of the flexible cSi wafers. Then, the flexible cSi wafers are dipped in 1:50 HF (49%) and DI H2O solution for 30 s to remove native oxide. The wafers are then rinsed using DI H2O and dried using nitrogen. To fabricate flexible bSi by one-step MCCE process, silver...
