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Keywords: Microelectronics packaging, Chip attachment
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2015) 32 (1): 37–42.
Published: 05 January 2015
... to the interposer if both Ag galvanic layers are sufficient thick. © Emerald Group Publishing Limited 2015 Microelectronics packaging, Chip attachment Nonpower SiC devices have the potential for applications able to work at temperatures of 600°C and pulsed testing power SiC devices work...
