..., Sn58Bi solder was doped into SAC105 solder to prepare a composite solder. Subsequently, the wettability, melting characteristics of the solder, microstructure of solder joints, mechanical properties and the growth of interfacial intermetallic compounds in the composite solder were investigated...

...Ahmed Bouchekhlal; Mohammed Boulesbaa Purpose The purpose of this paper is to investigate the effects of the sintering temperature on the microstructural, morphological and electrical characteristics of Zinc oxide (ZnO)-based varistors. Design/methodology/approach This study used...

...Alena Pietrikova; Tibor Rovensky; Juraj Durisin; Igor Vehec; Ondrej Kovac Purpose The purpose of this paper is to analyse the influence of various firing profiles on microstructural and dielectric properties of low-temperature, co-fired ceramic (LTCC) substrates in a GHz frequency range. According...

...Dr Agata Skwarek; Piotr Guzdek; Marek Wzorek Purpose – The purpose of the paper was to present a comparative study on the microstructure and magnetoelectric effect of new magnetoelectric composites based on TbFe₂ compound...