.... Originality/value The paper focuses on the reliability impact dendritic growth in saturated conditions. R.D. Pilkington can be contacted at: r.d.pilkington@salford.ac.uk © Emerald Group Publishing Limited 2007 Printed circuits Moisture Reliability management The tracks, pads...

...Vijaya Puri; S.M. Salunkhe; M.M. Puranik Purpose Use of thin film microstrip patch antenna for leaf moisture studies. Design/methodology/approach In this paper, the studies on the effect of leaf used as in‐touch overlay on thin film microstrip patch antenna in the X band (8‐12 GHz) is reported...

... conditions. Molded IC packages utilize thermosetting compounds for packaging. These materials may not show visible signs of distress from the no‐lead cycle, but the integrity of the package could be compromised by the quick evaporation of moisture in the package caused by the higher processing temperatures...

... be vulnerable to failure mechanisms associated with exposure to temperature and humidity. In some applications, conformal coating has been used as a potential means to mitigate these problems by enhancing moisture ingress resistance. This study focused on the ability of two popular kinds of conformal coatings...

...P. Coupier; J. Ph. Peltier; E. Pilat For a considerable time moisture level has been a problem for hermetic package assembly, although the materials used were only metallics. Today semiconductor technology is cost driven, therefore organic materials must be taken into account. Obviously...

...S.B. Rane; V. Puri This paper reports the behaviour of a parallel coupled band pass microstrip filter due to an Al₂O₃ thin film‐thick film overlay and the effect of the moisture ambient on the properties of the overlaid microstrip filter. The thickness of the initial thin‐film...