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Keywords: Moisture effect
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Journal Articles
Process factors affecting adhesion of encapsulation molding compounds
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Journal:
Microelectronics International
Microelectronics International (2018) 35 (2): 97–103.
Published: 03 April 2018
.... and Chang , T.-S. (2014), “ Experimental and numerical study of moisture effect on warpage of plastic package ”, Proceeding of International Conference on Electronic Packaging Technology 2014 , Chengdu , pp. 801 - 805 . Cheng , X.-M. , Liu , H.-J. , Tan , W. , Qiu , C. , Li , L...
