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Keywords: Molding temperature
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Journal Articles
Process factors affecting adhesion of encapsulation molding compounds
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2018) 35 (2): 97–103.
Published: 03 April 2018
.... Design/methodology/approach EMCs were molded to Cu leadframes to experimentally quantify the effect of mold temperature, resin viscosity, leadframe oxidation and powder moisture on the adhesion force. Component reliability was assessed by PCT. Findings A higher mold temperature result in a larger...
