..., laser structuring for local chip fan-out or fine line structuring on single layers. For further miniaturization of thick-film multilayers circuits, after solving the fine line resolution, the reduction of electrical connection of conductive layers through printed insulation/dielectric layer (via...

... and electronics in one silicon chip. The solution is using Low Temperature Cofired Ceramics (LTCC) technique to fabricate a multilayer electronic substrate with deposited thick‐film components (Golonka, 2006 ; Gongora‐Rubio et al., 2001 ; Wu and Yong Huang, 2003). Such a multilayer electronic substrate...