...C. Salame; R. Habchi Purpose The purpose of this paper is to discuss the temperature failure effect on electronic components and their electrical parameters variation. Design/methodology/approach The MOSFET device parameters analysis was done by numerical analysis based on a double exponential...

... accuracy, efficiency and simulation cost. Simulation Numerical analysis Semiconductors Temperature L_i=materials thickness (m) k_i=thermal conductivity of the material (i)(W.K⁻¹.m^{−1) In this paper, thermal}...

... have a volume 0.5 mm×a×0.53 mm, and they act as a strong enhancement to the PBG characteristics. © Emerald Group Publishing Limited 2006 Finite difference time‐domain analysis Algorithmic languages Numerical analysis Photonic band‐gap (PBG) structures have attracted much...