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Keywords: Plating
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (1997) 14 (1): 9–13.
Published: 01 April 1997
...H. Richter; K. Ruess; A. Gemmler; W. Leonhard Bumping is a prerequisite for flip‐chip attachment of bare dies. For silicon semiconductors bumping is normally performed on the ICs at wafer scale. Bumping can be performed by micro‐plating or vacuum deposition techniques. Mechanical methods are also...
