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Keywords: RDL
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2023) 40 (2): 104–108.
Published: 30 September 2022
... packaging process; two layers were interconnected with TSV and re-distributed layers. 5G TSV AIP RDL W-band WLFO With the rocketing operating frequency of novel radio frequency (RF) applications up to millimeters wave and higher push urgent demand to packaging technology with precisely...
