... Microelectronics packaging SPICE Electrothermal models GaN Schottky diodes Thermal phenomena where V_BR0 means breakdown voltage in temperature T₀, α_BR – the temperature coefficient of breakdown voltage, I_BR...

...Krzysztof Górecki; Paweł Górecki Purpose This paper aims to propose the electrothermal dynamic model of the insulated gate bipolar transistors (IGBT) for SPICE. Design/methodology/approach The electrothermal model of this device (IGBT), which takes into account both electrical and thermal...

... in SPICE software, the influence of such factors as on-state resistance of the channel of the MOS transistor, the self-heating phenomena in this transistor and resistance of wires connecting transistors with the other part of the circuit on characteristics of the considered circuit operating with resistor...

.... Microelectronics packaging Solid-state lighting Self-heating Thermal parameters Multi-chip modules (MCMs) Power LEDs Thermal phenomena SPICE Solid-state light sources are more and more frequently used in lighting engineering (Weir, 2012 ; Krames, 2003 ; Górecki, 2013 ; Craford, 2007...