... the Agilent B1500A Semiconductor Device Analyzer and the Cascade TESLA200 Probe station at temperatures of −40°C, 25°C and 125°C. All the measurements were done under vacuum conditions without light exposure. For reliability characteristics, the Zener diode was stressed at 175°C with an 80 µA in the reverse...

... only HEMT Gate length High breakdown Metal evaporation Semiconductor device Sub-um These days, the pseudomorphic High Electron Mobility Transistor (pHEMT) has been used widely in the sector of microwave and millimeter-wave because this device has a unique character such as high...

... mechanical polishing (CMP) for semiconductor devices, key/additional process conditions for CMP, and polishing and grinding for microelectronics fabrications and fan-out wafer level packages (FOWLPs). Findings Many reviewed articles reported advanced CMP for semiconductor device fabrications...