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Keywords: SiC power devices
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Journal Articles
Journal:
Microelectronics International
Microelectronics International (2015) 32 (3): 143–148.
Published: 03 August 2015
... were made using Cu foil electroplated by Ag layer. Silver sintering technology was used for the ribbon connections assembly to the DBC substrate. Microelectronics packaging Advanced packaging Ag sintering SiC power devices Ceramic package Plastic packages are frequently used...
