...C.G.J. Schabmueller; A.G.R. Evans; A. Brunnschweiler; G. Ensell; D.L. Leslie; M.A. Lee Reports the design, fabrication and packaging of a micromachined silicon/Pyrex based chip for the polymerase chain reaction (PCR). The anodic bonding method is used for sealing the chambers of 1μl volume...

... "In future, IP will become the essential condition for doing global business',' said Theo Claasen, chief technology officer, Philips Semiconductors."OEMs will no longer choose their silicon suppliers purely on the grounds of semiconductor process technologies, design flows and manufacturing...

...Darko Belavič; Stojan Šoba; Marko Pavlin; Dubravka Ročak; Marko Hrovat Silicon piezoresistive pressure sensor dies are mounted on a ceramic substrate where the signal conditioning electronics are implemented in thick film technology. In this paper some of these techniques, e.g. special attachment...