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Journal Articles
Recent advances and applications of abrasive processes for microelectronics fabrications
Available to Purchase
Journal:
Microelectronics International
Microelectronics International (2019) 36 (4): 150–159.
Published: 27 September 2019
... and innovative research studies on CMP slurry and abrasives. The surface finish, sub-surface damage and the strength of wafers are important issues. The defects on wafer surfaces induced by grinding/polishing would affect the stability of diced ultra-thin chips. Fracture strengths of wafers are dependent...
